CMOS芯片灰尘检测与清除

Application industry

◆Semiconductor (optical module, chip)

◆Camera module       

◆Sealing and testing industry (sensor, IR film, IC sealing and testing, fingerprint module)

Device configuration

◆Flexible force control nondestructive dust removal        

◆Imported camera and automatic zoom system  

◆One μ Removal rate of movable dust above m is 100% (bare core)

◆The detection accuracy can reach nanometer level, and the anti-seismic marble platform     

◆Equipped with automatic loading and unloading device, NG marking device, which can be connected and used alone

◆The cleanliness of the internal environment of the equipment is CLASS 100    

◆Recheck function can be set         

◆Underkill ≤ 0.2%                       

◆Overkill ≤ 2%

Detection type

◆CMOS chips of all processes, size specification: ≥ 2X2mm, ≤ 20X20mm

◆Dust and other defects on chip surface, IR upper and lower surfaces

Check the accuracy

0.5um(Excluding ± 1 pixel size deviation, excluding defects less than 30 gray values)

Vision system

◆80M x 1 set                            

◆Pixel resolution：0.1um 

◆View：10mm x 10mm            

◆Light source: design of automatic and controllable multi-lamp system

UPH

1500-2200pcs/H

Equipment parameters

◆Equipment weight：2500KG         

◆Equipment power：5KW， AC220 

◆Size：W2300mm×D1400mm×H2000mm